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EMS Semiconductor Unicomp X Ray Inspection Machine Electronics BGA AX8200

Categories Unicomp X Ray
Brand Name: UNICOMP
Model Number: AX8200
Certification: CE, FDA
Place of Origin: China
MOQ: 1Set
Price: can negotiate
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Delivery Time: 30 days
Packaging Details: Wooden Case, Waterproof, Anti-collision
Name: Unicomp X-ray Inspection Machine
Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage: 100KV
Industry: Electronics Industry
Size: 1080(L)x1180(W)x1730(H)mm
X-ray Leakage: < 1uSv/h
Weight: 1150kg
Power Consumption: 0.8kW
Company Info.
Unicomp Technology
Verified Supplier
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    EMS Semiconductor Unicomp X Ray Inspection Machine Electronics BGA AX8200

    EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200


    The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 is capable of addressing small and large volume factory requirements. (Contact us for details)



    Features:


    ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera.


    ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement.


    ● Multi-function DXI image processing system


    ● X/Y programming function for multiple image inspection routines


    ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification.


    BGA void/area auto-measurement plus report generation.


    Applications:


    BGA , CSP , LED , Flip Chip , Semiconductor,


    Battery Industry , Small Metal Casting,


    Electronic Connector Module,


    Aerospace Components , Photovoltaic Industry,


    Other Special Industries.


    Item

    Definition

    Specs

    System Parameters

    Size

    1080(L)x1180(W)x1730(H)mm

    Weight

    1150kg

    Power

    220AC/50Hz

    Power Consumption

    0.8kW

    X-ray Tube

    Type

    Closed

    Max.Voltage

    90kV/100kV

    Max.Power

    8W

    Spot Size

    5μm

    X-ray System

    Intensifier

    4"Image Intensifier

    Monitor

    22"LCD

    System Magnification

    600x

    Detection Region

    Max.Loading Size

    510mm x 420mm

    Max.Inspection Area

    435mm x 385mm

    X-ray Leakage

    < 1uSv/h



    Inspection Images:
























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